Taiwan Semiconductor Manufacturing Company Limited TSM NYSE

Taiwan Semiconductor Manufacturing Company Limited (TSM) 报告总资产为 $7.91T 总负债为 $2.47T 財年 2025, 总权益为 $5.45T.

公司持有 $3.06T 现金及短期投资. 总债务为 $1.06T, 净债务为 $-1.7T. D/E比率为 0.2 (保守的).

流动比率为 2.62, 表明短期流动性强.

本页支持的标准:

• HEALTH (100/100, Pass) — Debt-to-Equity of 0.2, current ratio of 2.62 — 资产负债表强劲
• MOAT (96/100) — 总资产 $7.91T 和 equity $5.45T 支持公司的竞争规模
• VALUE (57/100) — Debt-to-Equity 0.2 影响整体估值风险评估

SharesGrow 收入评分: 89/100 其中 6/7 项标准通过.

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