BE Semiconductor Industries N.V. (BESIY) は上場企業です テクノロジー セクターの 半導体 業界で事業展開. 本社所在地は Duiven, オランダ. 現CEOは Richard W. Blickman.
BESIY を有する IPO日 1995-12-05, 1,820 名の正社員, に上場 Other OTC, 時価総額 $21B.
BE Semiconductor Industries N.V. is a global manufacturer of semiconductor assembly equipment serving the semiconductor and electronics industries. The company specializes in die attach equipment, packaging systems, and plating equipment, along with related process chemicals, tooling, and spare parts. Its portfolio includes advanced technologies such as flip chip bonding, wafer level packaging, and molding systems, marketed under established brand names including Datacon, Esec, Fico, and Meco. BE Semiconductor primarily serves multinational chip manufacturers, assembly subcontractors, and industrial electronics companies worldwide. Founded in 1995 and headquartered in Duiven, the Netherlands, the company is a key supplier to the semiconductor assembly sector.
