Disco Corporation (DSCSY) は上場企業です テクノロジー セクターの 半導体 業界で事業展開. 本社所在地は Tokyo, 日本. 現CEOは Kazuma Sekiya.
DSCSY を有する IPO日 2021-01-08, 4,886 名の正社員, に上場 Other OTC, 時価総額 $50.19B.
Disco Corporation is a Tokyo-based manufacturer of precision cutting, grinding, and polishing equipment founded in 1937. The company produces a comprehensive range of machines including dicing saws, laser saws, grinders, polishers, wafer mounters, and die separators, along with specialized tools such as dicing blades and grinding wheels for semiconductor and electronics manufacturing. Beyond equipment manufacturing, Disco provides processing consumables, maintenance training, machine leasing services, and used equipment sales and refurbishment. The company serves customers in Japan and internationally, supporting critical processes in wafer processing and component singulation across the semiconductor industry.
