Disco Corporation (DISPF) は上場企業です テクノロジー セクターの 半導体 業界で事業展開. 本社所在地は Tokyo, 日本. 現CEOは Kazuma Sekiya.
DISPF を有する IPO日 2009-09-16, 4,886 名の正社員, に上場 Other OTC, 時価総額 $49.8B.
Disco Corporation is a Tokyo-based precision equipment manufacturer founded in 1937 that designs and produces cutting, grinding, and polishing machines for semiconductor and electronics processing. The company's product portfolio includes dicing saws, laser saws, grinders, polishers, wafer mounters, and related precision processing tools such as dicing blades and grinding wheels, along with consumables and accessory equipment. Beyond manufacturing, Disco provides comprehensive support services including machine leasing, used equipment sales, recycling programs, and technical training for customers worldwide.
