Disco Corporation (DISPF) ist ein börsennotiertes Unternehmen im Technologie Sektor, tätig in der Halbleiter Branche. Der Hauptsitz des Unternehmens ist in Tokyo, Japan. Der aktuelle CEO ist Kazuma Sekiya.
DISPF hat IPO-Datum 2009-09-16, 4,886 Vollzeitbeschäftigte, gelistet an der Other OTC, eine Marktkapitalisierung von $49.8B.
Disco Corporation is a Tokyo-based precision equipment manufacturer founded in 1937 that designs and produces cutting, grinding, and polishing machines for semiconductor and electronics processing. The company's product portfolio includes dicing saws, laser saws, grinders, polishers, wafer mounters, and related precision processing tools such as dicing blades and grinding wheels, along with consumables and accessory equipment. Beyond manufacturing, Disco provides comprehensive support services including machine leasing, used equipment sales, recycling programs, and technical training for customers worldwide.
