Disco Corporation (DSCSY) est une société cotée en bourse dans le Technologie secteur, opérant dans le Semi-conducteurs secteur d'activité. Le siège social de l'entreprise est situé à Tokyo, Japan. Le PDG actuel est Kazuma Sekiya.
DSCSY a date d'introduction en bourse 2021-01-08, 4,886 employés à temps plein, cotée sur le Other OTC, une capitalisation boursière de $50.19B.
Disco Corporation is a Tokyo-based manufacturer of precision cutting, grinding, and polishing equipment founded in 1937. The company produces a comprehensive range of machines including dicing saws, laser saws, grinders, polishers, wafer mounters, and die separators, along with specialized tools such as dicing blades and grinding wheels for semiconductor and electronics manufacturing. Beyond equipment manufacturing, Disco provides processing consumables, maintenance training, machine leasing services, and used equipment sales and refurbishment. The company serves customers in Japan and internationally, supporting critical processes in wafer processing and component singulation across the semiconductor industry.
