Disco Corporation (DSCSY) is a publicly traded company in the Technology sector, operating within the Semiconductors industry. The company is headquartered in Tokyo, Japan. The current CEO is Kazuma Sekiya.
DSCSY has IPO date of 2021-01-08, 4,886 full-time employees, listed on the Other OTC, a market capitalization of $50.19B.
Disco Corporation is a Tokyo-based manufacturer of precision cutting, grinding, and polishing equipment founded in 1937. The company produces a comprehensive range of machines including dicing saws, laser saws, grinders, polishers, wafer mounters, and die separators, along with specialized tools such as dicing blades and grinding wheels for semiconductor and electronics manufacturing. Beyond equipment manufacturing, Disco provides processing consumables, maintenance training, machine leasing services, and used equipment sales and refurbishment. The company serves customers in Japan and internationally, supporting critical processes in wafer processing and component singulation across the semiconductor industry.
