Disco Corporation (DSCSY) 은(는) 상장 기업입니다 기술 섹터의 반도체 산업에서 운영. 본사 소재지는 Tokyo, 일본. 현재 CEO는 Kazuma Sekiya.
DSCSY 을(를) 보유 IPO 날짜 2021-01-08, 4,886 명의 정규직 직원, 에 상장 Other OTC, 시가총액 $50.19B.
Disco Corporation is a Tokyo-based manufacturer of precision cutting, grinding, and polishing equipment founded in 1937. The company produces a comprehensive range of machines including dicing saws, laser saws, grinders, polishers, wafer mounters, and die separators, along with specialized tools such as dicing blades and grinding wheels for semiconductor and electronics manufacturing. Beyond equipment manufacturing, Disco provides processing consumables, maintenance training, machine leasing services, and used equipment sales and refurbishment. The company serves customers in Japan and internationally, supporting critical processes in wafer processing and component singulation across the semiconductor industry.
