Disco Corporation (DSCSY) es una empresa que cotiza en bolsa en el Tecnología sector, operando dentro de la Semiconductores industria. La empresa tiene su sede en Tokyo, Japan. El CEO actual es Kazuma Sekiya.
DSCSY tiene fecha de IPO 2021-01-08, 4,886 empleados a tiempo completo, cotiza en el Other OTC, una capitalización de mercado de $50.19B.
Disco Corporation is a Tokyo-based manufacturer of precision cutting, grinding, and polishing equipment founded in 1937. The company produces a comprehensive range of machines including dicing saws, laser saws, grinders, polishers, wafer mounters, and die separators, along with specialized tools such as dicing blades and grinding wheels for semiconductor and electronics manufacturing. Beyond equipment manufacturing, Disco provides processing consumables, maintenance training, machine leasing services, and used equipment sales and refurbishment. The company serves customers in Japan and internationally, supporting critical processes in wafer processing and component singulation across the semiconductor industry.
