Disco Corporation (DSCSY) ist ein börsennotiertes Unternehmen im Technologie Sektor, tätig in der Halbleiter Branche. Der Hauptsitz des Unternehmens ist in Tokyo, Japan. Der aktuelle CEO ist Kazuma Sekiya.
DSCSY hat IPO-Datum 2021-01-08, 4,886 Vollzeitbeschäftigte, gelistet an der Other OTC, eine Marktkapitalisierung von $50.19B.
Disco Corporation is a Tokyo-based manufacturer of precision cutting, grinding, and polishing equipment founded in 1937. The company produces a comprehensive range of machines including dicing saws, laser saws, grinders, polishers, wafer mounters, and die separators, along with specialized tools such as dicing blades and grinding wheels for semiconductor and electronics manufacturing. Beyond equipment manufacturing, Disco provides processing consumables, maintenance training, machine leasing services, and used equipment sales and refurbishment. The company serves customers in Japan and internationally, supporting critical processes in wafer processing and component singulation across the semiconductor industry.
